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FEWI DEVELOPMENT CORPORATION Failure Analysis Engineer in STURTEVANT, Wisconsin

JOB REQUIREMENTS: Foxconn Industrial Internet (Fii), is a world leading professional design and manufacturing service provider of communication network equipment, cloud service equipment, precision tools and industrial robots. FII provides customers with intelligent manufacturing services for new forms of electronic equipment products centered on the industrial Internet platform. The Failure Analysis Engineer will support new product development and continuous improvement of our contract manufacturing services. You will be responsible for technical assessments and compliance activities to ensure that potential risks are analyzed and controlled, and that product/system performance is quantifiably predicted. Job Responsibilities Include: Understand customer technical product reliability requirements, identify capability gaps, develop plans for execution and implementation. Lead the technical discussions with internal and external customers. Assure that all standards are being followed and met. Perform PCB & PCBA Cross sectioning, analyze, identify issues and develop reports for barrel fill and issues related to Copper dissolution. Analyze and identify the cause of failures for a wide variety of product types including but not limited to Image Sensors, ASICs, Analog, Mixed Signal and Discretes. Electrical characterization and bench testing of failure mode using lab equipment like power supplies, parametric analyzers, oscilloscopes, DMMs, function generators, evaluation boards and other bench test equipment to develop a sound Failure Analysis plan. Utilize fault localization techniques like Lock-in Thermography, Photoemission, OBIRCh, DALS, EOP/EOFM, EBIC, EBAC, Microprobing and ATPG diagnosis. Write detailed high quality Failure Analysis reports to summarize findings. Complete projects and document procedures and processes related lab development, advancement and maintenance activities Perform Dye & pry test on PCBA's, analyze, identify issues and develop reports for reflow solderability. Perform Thermal shock test for PCBA's, analyze, identify issues and develop reports. Initiate, sustain & maintain NPI lab activities. Collaborate with cross -functional engineering team, support NPI launch activities, NPI qualification targets and ramp up. Reviews customer Engineering Change Notices... For full info follow application link. Foxconn provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, sex, national origin, age, disability or genetics. In addition to federal law requirements, Foxconn complies with applicable state and local laws governing nondiscrimination in employment in every location in which the company has facilities. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, and transfer, leaves of absence, compensation and training. ***** APPLICATION INSTRUCTIONS: Apply Online: ipc.us/t/79927CE940A540E3

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