Skyworks Packaging Principal Engineer in Irvine, California
Packaging Principal Engineer
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Date:Feb 10, 2021
Location:Irvine, CA, US
If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high performance analog semiconductors whose solutions are powering the wireless networking revolution. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creativity and out-of-the-box thinking. Our work culture values diversity, social responsibility, open communication, mutual trust and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together can change the way the world communicates.
Requisition ID: 63166
PRIMARY RESPONSIBLITY: Develops new packaging or containers to meet established requirements and maintains oversight and quality of existing packages/containers for all product groups. Defines package requirements for product groups and customer requirements. Develops recommendations according to the nature of the product, cost limitations, legal requirements, and the type of protection required, taking into consideration the need for resistance to external variables. May be responsible for coordination of activities and logistics at secondary contract packaging and labeling sites. Responsibilities may include documentation management and an understanding of good manufacturing practices (GMPs). Uses appropriate tools and performs integrity analysis of packaging.
Job Overview:Skyworks Packaging group is responsible for developing and enabling new packaging technologies for high volume manufacturing. Packaging team is seeking an experienced professional who has worked with various packaging technologies such as Flip chip, Wire bonding, WLCSP and SIP module packaging. We are looking for individuals who are innovative, creative, self-driven, and work well within a team.
Responsibilities:• Responsible from exploring business justification to process development and HVM deployment of SiP (System in Package) Module packaging technologies• Responsible for defining package material set, process flow, equipment, DOEs to successfully develop and characterize reliable SIP/Module products• Interface with OSATs in developing, qualification and HVM production of SiP module products• Strong knowledge and experience in SIP Module packaging, familiar with flip chip, wire bonding, Underfill, Molding, SMT, failure analysis, reliability test and other semiconductor packaging technologies• Strong IC packaging materials background including characterization and failure analysis• Technical program management to plan, execute, and monitor complex process or product developments• Ability to work independently and work with multi-functional teams
Minimum Qualifications:• Bachelor’s degree required in Mechanical Engineering, Material Science, Electrical Engineering, Physics or relevant technical discipline. • 8+ years microelectronic packaging related work experience; Hands-on experience a plus
Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.
Nearest Major Market:Irvine CaliforniaNearest Secondary Market:Los AngelesJob Segment:Electronics Engineer, Package Design, Manufacturing Engineer, Engineer, Network, Engineering, Manufacturing, Technology
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