USACares Jobs

Job Information

Intel Thin Films Module Engineer in Hillsboro, Oregon

Job Description

Defines roadmaps to meet requirements, goals and milestones for a new technology process. Defines and establishes flow, procedures, and equipment configuration for the module. Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle. Drives improvements on quality, reliability, cost, yield, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problemsolving tools. Establishes process control systems for the process module and sustains the module through volume ramp. Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future. Trains production/receiving process engineers for transfer to other factories. Transfers process to high volume manufacturing and provide support in new factory startup as well as install and qualification of the new production lines.

Qualifications

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

Candidate must possess a Master's degree in Electrical Engineering, Chemical Engineering, Material Science, Physics or Chemistry, or a related field with greater than 8 years of experience in semiconductor manufacturing. Or a PhD degree with greater than 4 year of experience in one or more of the following:

o Sustaining duties including tool ownership and delivering a robust, manufacturable module

o Hands on experience using and maintaining scientific equipment

o Hands on experience using and maintaining scientific equipment

o Semiconductor materials processing experience

o Research experience with advanced transistor device structures and architectures including fabrication (e.g. lithography, etch, film deposition, cleans, chemical-mechanical planarization, etc.)

o Expertise on characterizing the electrical performance of leading-edge transistor devices including current-voltage, capacitance-voltage, high frequency characterization (ft, fmax), gate delay, etc. and performing device and circuit simulation to confirm analysis.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

DirectEmployers